SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING

Yue-Seon Shin, Young-Ki Ko, Jun-Ki Kim, Sehoon Yoo () and Chang-Woo Lee ()
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Yue-Seon Shin: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Young-Ki Ko: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Jun-Ki Kim: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Sehoon Yoo: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Chang-Woo Lee: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea

Surface Review and Letters (SRL), 2010, vol. 17, issue 02, pages 201-205

Abstract: SiC-mixed Sn–58Bi composite solder bumps were successfully fabricated via an electroplating process. For the composite solder bump fabrication, ultrasonically dispersed SiC nanoparticles were added to the plating solutions. DSC analysis indicated that the melting temperature of SiC-mixed Sn–58Bi solders was the same as that of the non-mixed Sn–58Bi. Shear strengths of Sn–58Bi+SiC solder bumps were 6% higher than that of non-mixed solder bumps. The thicknesses of intermetallic compound were almost the same for both Sn–58Bi and Sn–58Bi+SiC samples. The Sn–58Bi+SiC composite solder bumps had finer lamellar structures than non-mixed Sn–58Bi. From the fracture surface analysis, fracture occurred at solder bump matrix, not at joint interface. Therefore, the addition of the SiC nanoparticles in the Sn–58Bi solders decreased the grain sizes, which increased the shear strengths.

Keywords: Sn–58Bi; SiC nanoparticles; Pb-free solders; solder bump; electroplating (search for similar items in EconPapers)
Date: 2010
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