Sub-400 nanometer-thick skin and environment adaptable organohydrogel nanofilm epidermal electrode

Zonglei Wang, Yuli Wang, Jiawei Yang, Pengcheng Zhou, Wenqing Yan, Shihong Lin, Yujie Zhang, Qingyuan Sun, Yumiao Xu, Zichong Ji, Mingzhe Wang, Zongman Zhang, Junhong Yi, Meiqiong Zheng, Xuezhong He, Lulu Sun, Sunghoon Lee, Tomoyuki Yokota, Hossam Haick, Takao Someya and Yan Wang ()
Additional contact information
Zonglei Wang: Shantou
Yuli Wang: Shantou
Jiawei Yang: Shantou
Pengcheng Zhou: Shantou
Wenqing Yan: Shantou
Shihong Lin: Shantou
Yujie Zhang: Shantou
Qingyuan Sun: Shantou
Yumiao Xu: Shantou
Zichong Ji: Shantou
Mingzhe Wang: Shantou
Zongman Zhang: Shantou
Junhong Yi: Shantou
Meiqiong Zheng: Shantou
Xuezhong He: Shantou
Lulu Sun: Wako
Sunghoon Lee: Wako
Tomoyuki Yokota: 7-3-1 Bunkyo-ku
Hossam Haick: Technion-Israel Institute of Technology
Takao Someya: Wako
Yan Wang: Shantou

Nature Communications, 2025, vol. 16, issue 1, 1-13

Abstract: Abstract Hydrogels are crucial for soft bioelectronics in long-term health monitoring; however, reconciling skin comfort with environmental resilience remains a major challenge. We present a 392 nm-thick organohydrogel nanofilm electrode that mimics skin deformation, offers high gas/water vapor/sweat permeability and heat transfer, and remains functional under various extreme conditions. The electrode comprises a genipin-crosslinked gelatin matrix, reinforced by polyurethane nanomeshes and plasticized with a glycerol/sodium chloride/tannic acid electrolyte. It achieves ultralow flexural rigidity (8.7 × 10−11 nN·m), high stretchability (166.3% strain), toughness (3.0 MJ m−3), adhesion (365.8 µJ cm−2), and durability (1000 cycles at 100% strain). Solvent replacement strategies suppress ice formation and evaporation, preserving its physical and electrical performance under extreme conditions (−80–150 °C, 2% relative humidity, vacuum) and 200-day ambient storage. The organohydrogel nanofilm electrodes record stable electrocardiograms for 9 consecutive days with superior resistance to motion and sweat artifacts, offering a resilient platform for skin-integrated bioelectronics.

Date: 2025
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DOI: 10.1038/s41467-025-65089-0

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