Open-source, multi-layer LSI design & fabrication framework for distributed IP development and education

Junichi Akita ()

International Journal of Innovative Research and Scientific Studies, 2023, vol. 6, issue 4, 936-945

Abstract: Continuous development of Large Scale Integration (LSI) technologies based on Moore's law results in highly developed LSI technologies, as well as very high costs in design and fabrication and high design complexity. This fact prevents various users from contributing to the activities of designing LSIs, fabricating LSIs, and developing Intellectual Properties (IPs). On the other hand, the trend towards open-source has been attracting attention to overcome these problems and extend the potential of LSI technologies. The purpose of this research is to develop an open-source LSI design framework aimed at connecting various layers of LSI knowledge. Its methodology is composed of two parts. One is the development of the LSI design flow using existing open-source EDA tools and their related glue software. The other is the open-source, NDA-free PDK (process design kit) used in designing LSIs. The process of developing and constructing Large Scale Integrated (LSI) circuits within this framework is conducted and assessed. From these trials, the effect of enhancing educational effectiveness on LSI design is indicated. These trials enhanced the contributors’ interest and motivation to understand the details of computer systems and their relation to LSIs. It is also indicated that this framework is effective in enhancing rapid IP development as well as its importance as an educational aspect of open-source software.

Keywords: EDA tools and PDK; IP development; LSI technologies; Moore’s law; Open-source; Technology education. (search for similar items in EconPapers)
Date: 2023
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Persistent link: https://EconPapers.repec.org/RePEc:aac:ijirss:v:6:y:2023:i:4:p:936-945:id:2102

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