Bridging the Gap: Materials, Processes, and Reliability in Advanced Heterogeneous Chip Packaging

Yuqin Huang

GBP Proceedings Series, 2025, vol. 13, 191-203

Abstract: Advanced heterogeneous chip packaging has emerged as a critical enabler for high-performance, low-power, and miniaturized electronic systems, bridging the gap between material innovation, process engineering, and reliability assurance. This review provides a comprehensive overview of state-of-the-art packaging technologies, including wafer-level and panel-level fan-out approaches, 3D integration, and hybrid bonding. Key aspects of substrate, interposer, dielectric, encapsulation, and interconnect materials are discussed in relation to thermal, mechanical, and electrical performance. Reliability challenges, such as thermo-mechanical stress, electromigration, and warpage, are examined alongside modeling and diagnostic strategies, including finite element analysis, digital twins, and advanced imaging. The review further explores emerging trends, including AI-assisted co-design, glass interposers, sustainable packaging, and integration for AI accelerators and quantum computing. By highlighting the intricate coupling of materials, processes, and reliability, this work outlines a roadmap for future research and development in intelligent, resilient, and environmentally conscious heterogeneous packaging.

Keywords: heterogeneous integration; advanced packaging; hybrid bonding; materials-process coupling; 3D integration (search for similar items in EconPapers)
Date: 2025
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Persistent link: https://EconPapers.repec.org/RePEc:axf:gbppsa:v:13:y:2025:i::p:191-203

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