Optimization of Thermal Stability and Insulation Performance of Polyimide (PI) Films in Flexible Electronic Devices

Haitao Wang

GBP Proceedings Series, 2025, vol. 14, 12-19

Abstract: This research aims to optimize the thermal stability of polyimide (PI) films and evaluate their insulating properties in flexible electronic devices. The thermal stability of PI films was optimized by chemical modification, physical doping, and other methods, and their insulating properties were systematically evaluated using key indicators such as breakdown field strength and dielectric constant. The research results show that through chemical modification methods such as molecular structure design and copolymer modification, as well as physical doping methods such as inorganic particle doping and application of nanocomposites, the thermal stability of PI films has been significantly improved. In addition, during the evaluation of insulating properties, it was found that the optimized PI films exhibit more stable breakdown field strength and dielectric constant under different environmental conditions, providing theoretical and practical support for the widespread application of PI films in the field of flexible electronic devices.

Keywords: polyimide film; thermal stability optimization; flexible electronic devices; insulation performance evaluation (search for similar items in EconPapers)
Date: 2025
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Persistent link: https://EconPapers.repec.org/RePEc:axf:gbppsa:v:14:y:2025:i::p:12-19

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