Microstructural Characterization of Copper-Bearing Mineral Residues and Their Potential for Environmental Remediation and Resource Recovery

Qiang Li

Strategic Management Insights, 2025, vol. 2, issue 1, 66-74

Abstract: The escalating global demand for copper and its associated mining and metallurgical activities have led to the generation of significant quantities of mineral residues, posing substantial environmental challenges. This study investigates the microstructural characteristics of a specific copper-bearing mineral residue, assumed to be derived from a conventional flotation tailing, using scanning electron microscopy (SEM) coupled with energy-dispersive X-ray spectroscopy (EDS). The SEM analysis revealed a complex morphology characterized by irregular shapes, varying particle sizes, and a highly porous, rough surface dotted with cracks and heterogeneous phase distributions. EDS elemental mapping confirmed the presence of copper (Cu), iron (Fe), sulfur (S), silicon (Si), and oxygen (O), indicating a mixed mineralogical composition likely comprising copper sulfides/oxides alongside silicates. Based on these microstructural attributes, this research conceptually explores the potential applications of this residue in environmental remediation, specifically for heavy metal ion adsorption, and as a viable secondary resource for copper recovery. Theoretical adsorption studies suggest a potentially high capacity for lead (Pb (II)) and cadmium (Cd (II)) removal, attributed to the high surface area and presence of active functional groups. Furthermore, the notable copper content identified by EDS underscores its economic viability for resource recovery. This work highlights the critical role of microstructural insights in transforming industrial byproducts into valuable assets for sustainable development and pollution control.

Keywords: copper-bearing residues; sem; microstructure; heavy metal adsorption (search for similar items in EconPapers)
Date: 2025
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Persistent link: https://EconPapers.repec.org/RePEc:axf:smiaaa:v:2:y:2025:i:1:p:66-74

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