Measuring Sovereign Bond Market Integration in Asia: A Wavelet Perspective

Shivam Sehgal and Jaspal Singh

Asian Economic Journal, 2025, vol. 39, issue 2, 155-186

Abstract: This present study examines the time‐varying relationship between the bond markets of Asian countries and global bond markets using wavelet techniques. The study focuses on the period from 2006 to 2022 and covers the Asian bond markets of China, Japan, Korea, India, and Singapore and global markets of the United States of America and European Union. The findings show a significant degree of positive co‐movement and integration between the bond markets of these Asian countries as well as with their global counterparts. However, integration varies, with short‐ and medium‐term coherence driven by crises and policy announcements, while long‐term patterns remain diverse.

Date: 2025
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https://doi.org/10.1111/asej.12351

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Persistent link: https://EconPapers.repec.org/RePEc:bla:asiaec:v:39:y:2025:i:2:p:155-186

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