Optimal reduction of a spatial monitoring grid: Proposals and applications in process control

Riccardo Borgoni, Luigi Radaelli, Valeria Tritto and Diego Zappa

Computational Statistics & Data Analysis, 2013, vol. 58, issue C, 407-419

Abstract: Deposition of silicon dioxide (SiO2) is a critical step of integrated circuit manufacturing; hence it is monitored during the manufacturing process at a grid of points defined on the wafer area. Since collecting thickness measurements is expensive, it is a compelling issue to investigate how a sub grid can be identified. A strategy based on spatial prediction and simulating annealing is proposed to tackle the problem which proved to be effective when applied to a real process. A diagnostic device for monitoring the deposition process is also discussed which can be usefully adopted in the day-to-day activity by practitioners acting in process control of a microelectronics fab.

Keywords: Kriging; Simulated annealing; Spatial sampling; Statistics for microelectronics (search for similar items in EconPapers)
Date: 2013
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Persistent link: https://EconPapers.repec.org/RePEc:eee:csdana:v:58:y:2013:i:c:p:407-419

DOI: 10.1016/j.csda.2012.08.007

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