Efficient two-phase liquid cooling and optimization technology on the chip side based on high-power data centers: Summary and prospects

Xinge Chen, Chudong Hu, Jun Liang, Jiangpeng Li, Lin Lu, Yan Wu and Jianbin Zang

Renewable and Sustainable Energy Reviews, 2025, vol. 223, issue C

Abstract: With the advent of the big data era and the rapid development of AI technology, the power demand of data centers is expected to exceed 1000 TWh by 2026, with more than 35 % of the electricity consumed by cooling systems. Additionally, the load and heat flux density of chips are increasing annually.The adoption of more efficient and energy-saving cooling methods is an inevitable trend. This paper reviews the latest research progress and optimization technologies of four two-phase liquid cooling methods for data center chip cooling, including direct liquid cooling technologies(Two-phase immersion and spray cooling) and indirect liquid cooling technologies(Two-phase cold plate and heat pipe cooling). It focuses on system configurations with high application potential in data centers and cooling optimization methods tailored to actual data center needs. While indirect cooling technologies are more mature but have limited cooling capacity. Spray cooling has higher cooling potential but lacks safety and stability. Two-phase immersion cooling performs well in all aspects and currently shows significant application potential. Overall, this article summarizes the current application status of data center cooling systems, and points out the direction for the application types and optimization paths of the system in the era of booming computing power.

Keywords: Big data era; Data centers; Chip level; Two-phase liquid cooling; Optimization technologies (search for similar items in EconPapers)
Date: 2025
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DOI: 10.1016/j.rser.2025.115994

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