EconPapers    
Economics at your fingertips  
 

Is Co-Invention Expediting Technological Catch Up? A Study of Collaboration between Emerging Country Firms and EU Inventors

Elisa Giuliani (), Arianna Martinelli and Roberta Rabellotti

World Development, 2016, vol. 77, issue C, 192-205

Abstract: Firms from emerging countries are going global, and Europe is attracting around one-third of their direct outward investments. Growing internationalization constitutes an opportunity for technological catch up. In this paper we analyze Brazilian, Indian, and Chinese cross-border inventions with European Union (EU-27) inventors, during the period 1990–2012. Our results suggest that these inventions represent an opportunity for emerging country firms to accumulate technological capabilities, access frontier knowledge, and appropriate the property rights of co-inventions. This paper contributes to understanding catching up by emerging country firms.

Keywords: technological catch up; patents; European Union; Brazil; China; India (search for similar items in EconPapers)
Date: 2016
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (21)

Downloads: (external link)
http://www.sciencedirect.com/science/article/pii/S0305750X15002004
Full text for ScienceDirect subscribers only

Related works:
Working Paper: Is Co-Invention Expediting Technological Catch Up? A Study of Collaboration between Emerging Country Firms and EU inventors (2014) Downloads
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:eee:wdevel:v:77:y:2016:i:c:p:192-205

DOI: 10.1016/j.worlddev.2015.08.019

Access Statistics for this article

World Development is currently edited by O. T. Coomes

More articles in World Development from Elsevier
Bibliographic data for series maintained by Catherine Liu ().

 
Page updated 2025-03-19
Handle: RePEc:eee:wdevel:v:77:y:2016:i:c:p:192-205