Advances in Boiling Heat Transfer Enhancement using Micro/Nano Structured Surfaces

Shreya Agarwal and Ranjan Kumar
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Shreya Agarwal: Visvesvaraya Technological University, India
Ranjan Kumar: Mechanical Engineering, Bangalore Institute of Technology, Bangalore, India

European Journal of Engineering and Technology Research, 2019, vol. 4, issue 11, 82-85

Abstract: In this article we present an inclusive review of research carried out in the field of phase change heat transfer enhancement. First, we discuss about different kinds of conventional heat transfer enhancement techniques performed in convection heat transfer related heat exchangers. Next, we present the advantages of implementing phase change heat transfer and report a brief introduction to the physics behind the phase change (boiling) heat transfer phenomenon. We present a well explained data about different kinds of enhancement techniques using micro and nano scale structures on heat transfer surface/device to increase the limit of boiling heat transfer. The entire review article is broadly divided into two categories: first the investigation related to fluid flow or transport mechanism over the micro/nano structured surface which is of crucial importance, second is the actual computational and experimental methods to achieve higher heat transfer capability in terms of critical heat flux (CHF) for a given surface/device. From the ongoing work, we are able to conclude and put forward three major stages of doing research in CHF enhancement using micro/nano structures/devices viz.: (i) selection and construction of micro/nano structures, (ii) perceiving the fluid transport through capillary over the micro/nano structured surface and (iii) actual experiment/computation to compare CHF of modified device with the base device.

Keywords: Heat Transfer Enhancement; Micro and Nano Structures; CHF; Boiling (search for similar items in EconPapers)
Date: 2019
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Persistent link: https://EconPapers.repec.org/RePEc:epw:ejeng0:v:4:y:2019:i:11:id:61647

DOI: 10.24018/ejeng.2019.4.11.1647

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