A Brief Review of Heat Sink, Heat Pipe, and Vapor Chamber as a Key Function of Thermal Solution for Electronic Devices

Mohamed Elnaggar, Mohammed Abu Hatab and Ezzaldeen Edwan
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Mohamed Elnaggar: Palestine Technical College – Deir El-Balah, Palestine
Mohammed Abu Hatab: Palestine Technical College – Deir El-Balah, Palestine
Ezzaldeen Edwan: Palestine Technical College – Deir El-Balah, Palestine

European Journal of Engineering and Technology Research, 2020, vol. 5, issue 11, 1297-1300

Abstract: Electronics industry requires efficient design that can handle fast mathematical operations to compensate for the growing development and demand for processing power. These days, there are numerous equipment or parts inside machines called heating elements particularly with electrical or electronic devices and they should be cooled during the working process. However, with respect to their size, manufacturers are minifying day by day to satisfy requirements of users but the power should be maintained. Hence, elements withstand a high amount of heat and high heat flux (transition/mutability) is being generated during the working process. The main contribution of this study is to investigate thermal solutions using four cooling tools and to compare to each other and consider thermal design guidelines and factors as well. Furthermore, we review the appropriate thermal solutions for the produced heat from the electronic equipment and we present the effective and suitable tools which used to dissipate this heat. A heat sink, heat pipe, and vapor chamber are reviewed and compared depending on the previous studies that have implemented them.

Keywords: Thermal solution; Vapor chamber; Heat sink; Heat pipe; electronic devices (search for similar items in EconPapers)
Date: 2020
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Persistent link: https://EconPapers.repec.org/RePEc:epw:ejeng0:v:5:y:2020:i:11:id:61596

DOI: 10.24018/ejeng.2020.5.11.1596

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