Phase Field Modeling of Ghost Diffusion in Sn-Ag-Cu Solder Joints

Naveen Weerasekera, Siyua Cao and Dawa Ram Shingdon
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Naveen Weerasekera: University of Louisville, USA
Siyua Cao: Portland State University, USA
Dawa Ram Shingdon: Nagoya University, Japan

European Journal of Applied Physics, 2022, vol. 4, issue 2, 28-34

Abstract: In this paper, we have introduced a phase field modeling technique to simulate ghost diffusion phenomena of intermetallic compounds in a bulk mettalic matrix phase. We used Zenner-Frank phase field approach to define free energy density functional which is to be evolved using Chan-Hilliard and Alan-Chan equations to simulate time evolution of the precipitates. We verified our simulation results with intermetallic compound growth of Sn-Ag-Cu solder joints in isothermal aging process attributing to the diffusion of Ag3Sn intermetallic compound. Herewith we present that Zenner-Frank model demonstrates sound validity and provides a best understanding of such phenomena.

Keywords: Ghost Diffusion; Microstructure Evolution; Phase Field Modeling; Precipitate Growth; Zenner-Frank Phase Field Model (search for similar items in EconPapers)
Date: 2022
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Persistent link: https://EconPapers.repec.org/RePEc:epw:physic:v:4:y:2022:i:2:id:11163

DOI: 10.24018/ejphysics.2022.4.2.163

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