Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test

Min-Soo Kang, Yu-Jae Jeon, Do-Seok Kim and Young-Eui Shin
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Min-Soo Kang: School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Korea
Yu-Jae Jeon: Department of Automotive, Yeoju Institute of Technology, Gyeonggi-do 12652, Korea
Do-Seok Kim: School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Korea
Young-Eui Shin: School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Korea

Energies, 2017, vol. 10, issue 4, 1-11

Abstract: In this study, the characteristics of a photovoltaic (PV) ribbon ( t = 0.25 mm) joint with 60Sn40Pb and 62Sn2Ag36Pb solders were evaluated using thermal shock tests. The thermal shock tests were performed under three conditions: ?40–65 °C, ?40–85 °C, and ?40–105 °C. The results of these tests were analyzed using electroluminescence (EL) and cross-sectional images. Following testing, broken metal fingers (MFs) were confirmed near the solder joint. PV module degradation was attributed to the broken finger ratio (BFR) based on quantitative analysis of the dark rectangular (DR) regions on the EL images. In addition, the activation energy of the broken MFs was calculated from the increasing BFR. Thermal characteristic variations due to the added Ag in the PV ribbon solder joints were evaluated through observation of solder micro-structure changes following thermal shock tests.

Keywords: electroluminescence (EL); dark rectangular (DR); broken finger ratio (BFR); 60Sn40Pb (SP); 60Sn2Ag38Pb (SAP) (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2017
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