Study on Insulation Breakdown Characteristics of Printed Circuit Board under Continuous Square Impulse Voltage

Quan Zhou, Mingqian Wen, Taotao Xiong, Tianyan Jiang, Ming Zhou, Xi Ouyang and Lai Xing
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Quan Zhou: State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China
Mingqian Wen: State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China
Taotao Xiong: State Grid Chengdu Power Supply Company, Chengdu 610000, China
Tianyan Jiang: School of Electrical and Electronic Engineering, Chongqing University of Technology, Chongqing 400050, China
Ming Zhou: State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China
Xi Ouyang: State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China
Lai Xing: State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China

Energies, 2018, vol. 11, issue 11, 1-13

Abstract: The widely distributed interconnects in printed circuit boards (PCBs) easily couple with high voltage under the action of electromagnetic pulses, which leads to insulation failure. In this study, the dielectric breakdown characteristics of four typical PCBs are studied under continuous square impulse voltage conditions. First, the electric field distribution in the four electrode models is simulated with the ANSYS software (ANSYS Maxwell 17.0). Electric field simulation results show the weak area of electric field distribution. On this basis, the possible breakdown patterns of PCB are analyzed. Second, the influence of factors, such as temperature, pulse duty ratio, interconnect insulation distance, and air pressure, on PCB breakdown voltage is studied through a breakdown test on the PCBs. Results show that the discharge between the single-layer electrodes of the PCBs is surface discharge, and the breakdown is that of a “gas–solid composite medium”. Meanwhile, the breakdown of a double-layer PCB is solid breakdown. Finally, scanning electron microscopy (SEM) produced by Tescan (Brno, Czech Republic) is performed to study the carbonization channel after PCB breakdown. SEM results reveal that the PCB carbonization channel is influenced by temperature and pressure in varying degrees.

Keywords: PCB; continuous square impulse voltage; electric field simulation; breakdown test; SEM (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2018
References: View complete reference list from CitEc
Citations: View citations in EconPapers (1)

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