Thermal Performance of Microencapsulated Phase Change Material (mPCM) in Roof Modules during Daily Operation
Qi Zhou,
Pin-Feng Liu,
Chun-Ta Tzeng and
Chi-Ming Lai
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Qi Zhou: Department of Civil Engineering, National Cheng Kung University, Tainan 701, Taiwan
Pin-Feng Liu: Department of Architecture, National Cheng Kung University, Tainan 701, Taiwan
Chun-Ta Tzeng: Department of Architecture, National Cheng Kung University, Tainan 701, Taiwan
Chi-Ming Lai: Department of Civil Engineering, National Cheng Kung University, Tainan 701, Taiwan
Energies, 2018, vol. 11, issue 3, 1-11
Abstract:
This study combines microencapsulated phase change materials (mPCMs) (core material: paraffin; melting points: 37 and 43 °C) and aluminum honeycomb boards (8 mm core cell) to form mPCM roof modules and investigates their heat absorption and release performances, as well as their impact on indoor heat gain by conducting experiments over a 24-h period, subject to representative weather. The outdoor boundary conditions of the module are hourly sunlight and nighttime natural cooling; on the indoor side of the module, the conditions are daytime air conditioning and nighttime natural cooling. The results indicate that compared to a roof module with a 43 °C melting point mPCM, the roof module with a 37 °C melting point mPCM had improved peak load-shifting capacity, but had a slightly increased indoor heat gain. The mPCMs in both roof modules were successfully cooled during the night, returning to their initial state, to begin a new thermal cycle the next day.
Keywords: phase change material (PCM); microencapsulated phase change material (mPCM); roof; heat transfer; thermal performance; building materials (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2018
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (5)
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Persistent link: https://EconPapers.repec.org/RePEc:gam:jeners:v:11:y:2018:i:3:p:679-:d:136759
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