Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material

H.M. Shih, Yi-Pin Lin, L.P. Lin and Chi-Ming Lai
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H.M. Shih: Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan 710, Taiwan
Yi-Pin Lin: Department of Creative Design, National Yunlin University of Science and Technology, Douliou 640, Taiwan
L.P. Lin: Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan 710, Taiwan
Chi-Ming Lai: Department of Civil Engineering, National Cheng Kung University, Tainan 701, Taiwan

Energies, 2019, vol. 12, issue 11, 1-13

Abstract: In this study, a heat management module containing a microencapsulated phase change material (mPCM) was fabricated from mPCM (core material: paraffin; melting temperature: 37 °C) and aluminum honeycomb structures (8 mm core cell). The aluminum honeycomb functioned both as structural support and as a heat transfer channel. The thermal management performance of the proposed module under constant-temperature boundary conditions was investigated experimentally. The thermal protection period of the module decreased as the Stefan number increased; however, increasing the subcooling factor could effectively enhance the thermal protection performance. When the cold-wall temperature T C was fixed at 17 °C and the initial hot wall temperature was 47–67 °C, the heat dissipation of the module was complete 140 min after the hot-wall heat supply was stopped. The time required to complete the heat dissipation increased to 280 min when T C increased to 27 °C.

Keywords: phase change material (PCM); microencapsulated phase change material (mPCM); heat transfer; thermal performance (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2019
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