Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements

Gabor Farkas, Zoltan Sarkany and Marta Rencz
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Gabor Farkas: Mentor, a Siemens business, Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, Hungary
Zoltan Sarkany: Mentor, a Siemens business, Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, Hungary
Marta Rencz: Mentor, a Siemens business, Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, Hungary

Energies, 2019, vol. 12, issue 14, 1-22

Abstract: Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in material quality and structural details on the raw heating or cooling curves. Higher precision can be achieved with the structure function technique where absolute and partial thermal resistance and capacitance values can be used for unambiguous identification of structural elements in a heat conducting path. Measurement techniques are presented to characterize the self-heating of a die and heat transfer between dice. Change of the thermal interface material layers in assembly during test sequences is also highlighted by the structure function concept. The power distribution between dice and wiring is analyzed by the newly introduced “accordion” principle.

Keywords: thermal transient testing; non-destructive testing; thermal testability; in-situ characterization (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2019
References: View complete reference list from CitEc
Citations: View citations in EconPapers (2)

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