Improvement of Heat Dissipation Characteristics of Cu Bus-Bar in the Switchboards through Shape Modification and Surface Treatment

Min-Jun Kim, Sang-Hwan Bak, Woo-Chul Jung, Deog-Jae Hur, Dong-Shin Ko and Man-Sik Kong
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Min-Jun Kim: Advanced Materials & Processing Center, Institute for Advanced Engineering (IAE), Yongin 175-28, Korea
Sang-Hwan Bak: Advanced Materials & Processing Center, Institute for Advanced Engineering (IAE), Yongin 175-28, Korea
Woo-Chul Jung: Advanced Materials & Processing Center, Institute for Advanced Engineering (IAE), Yongin 175-28, Korea
Deog-Jae Hur: Research & Business Cooperation Center, Institute for Advanced Engineering (IAE), Yongin 175-28, Korea
Dong-Shin Ko: Research & Business Cooperation Center, Institute for Advanced Engineering (IAE), Yongin 175-28, Korea
Man-Sik Kong: Advanced Materials & Processing Center, Institute for Advanced Engineering (IAE), Yongin 175-28, Korea

Energies, 2019, vol. 12, issue 1, 1-11

Abstract: In order to improve energy efficiency by increasing heat dissipation performance of bus-bar which distributes the current in high-power switchboard, the heat dissipation effects of the shape modification and surface treatment of Cu bus-bar were studied. The surface temperatures of the conventional plate-type bus-bar, and the improved tunnel-type bus-bar were compared by using electromagnetic and thermal analyses. The optimum thickness of tunnel-type bus-bar and the spacing and array among three bus-bars were calculated; and the surface temperature of tunnel-type bus-bar showed 7.9 °C lower than that of plate-type bus-bar in a 3-phase array condition. In addition, the surface and internal temperatures of the uncoated, CNT (Carbon nanotube)-coated, and BN (Boron nitride)-coated Cu bus-bars were measured with thermal imaging camera and the experiment using a hot plate. It was confirmed that the difference in the internal temperature between uncoated and BN-coated Cu was 19.4 °C. The application of the bus-bar improved from this study might contribute to the increase in power energy efficiency.

Keywords: switchboard system; Cu bus-bar; heat dissipation; electromagnetic thermal analysis; boron nitride coating (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2019
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (1)

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