TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages

Lorenzo Codecasa, Salvatore Race, Vincenzo d’Alessandro, Donata Gualandris, Arianna Morelli and Claudio Maria Villa
Additional contact information
Lorenzo Codecasa: Department of Electronics, Information and Bioengineering, Politecnico di Milano, 20133 Milan, Italy
Salvatore Race: Department of Electrical Engineering and Information Technology, University Federico II, 80125 Naples, Italy
Vincenzo d’Alessandro: Department of Electrical Engineering and Information Technology, University Federico II, 80125 Naples, Italy
Donata Gualandris: STMicroelectronics, 20864 Agrate Brianza, Italy
Arianna Morelli: STMicroelectronics, 20864 Agrate Brianza, Italy
Claudio Maria Villa: STMicroelectronics, 20864 Agrate Brianza, Italy

Energies, 2019, vol. 12, issue 6, 1-10

Abstract: This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can vary in a chosen set. Additionally, it can apply a novel model-order reduction-based approach for the automatic and fast extraction of a parametric compact thermal model of such packages. Furthermore, it is suited to automatically determine the joint electron device engineering council (JEDEC) thermal metrics for any choice of parameters in a negligible amount of time. The tool was validated through the analysis of two families of quad flat packages.

Keywords: electronic packages; JEDEC metrics; model-order reduction; thermal simulation (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2019
References: View complete reference list from CitEc
Citations: View citations in EconPapers (1)

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