Numerical Studies on the Performance of the PCM Mesh-Finned Heat Sink Base on Thermal-Flow Multiphysics Coupling Simulation
Jiefeng Liu,
Shangxin Yu,
Shichang Yang,
Yiyi Zhang,
Xianhao Fan and
Bing Gao
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Jiefeng Liu: Guangxi Key Laboratory of Power System Optimization and Energy Technology, Guangxi University, Nanning 530004, China
Shangxin Yu: Guangxi Key Laboratory of Power System Optimization and Energy Technology, Guangxi University, Nanning 530004, China
Shichang Yang: Guangxi Key Laboratory of Power System Optimization and Energy Technology, Guangxi University, Nanning 530004, China
Yiyi Zhang: Guangxi Key Laboratory of Power System Optimization and Energy Technology, Guangxi University, Nanning 530004, China
Xianhao Fan: Guangxi Key Laboratory of Power System Optimization and Energy Technology, Guangxi University, Nanning 530004, China
Bing Gao: College of Electrical and Information, Hunan University, Changsha 410205, China
Energies, 2020, vol. 13, issue 18, 1-17
Abstract:
Operating temperature is an important parameter of thyristors to ensure the stable operation of power electronic devices. Thermal management technology is of great significance for improving the reliability of thyristors. In this study, the performance of a phase change material (PCM) mesh-finned heat sink is investigated for the thermal management of thyristors. A multi-physical coupling model of the PCM mesh-finned heat sink is established to analyze the effects of different power losses, air velocities, heights of fins, and thickness of PCM on the thermal performance of the PCM heat sink. The influence of thermal and flow fields on PCM is considered in this model. Furthermore, the heat sink design is optimized to improve the thermal performance based on the calculation results of thermal network parameters. The results show that the power losses, the air velocity, the height of fins, and the thickness of PCM significantly affect the protection ability of the PCM heat sink. After optimizing the heat sink, the PCM heat sink provides 80 s protection time and 100 s recovery time. The PCM mesh-finned heat sink demonstrated good potential for the thermal management of thyristors.
Keywords: heat sink; PCM; multiphysics coupling; thyristor; temperature field; thermal network parameters (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2020
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (1)
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Persistent link: https://EconPapers.repec.org/RePEc:gam:jeners:v:13:y:2020:i:18:p:4658-:d:410281
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