Small-Sized Pulsating Heat Pipes/Oscillating Heat Pipes with Low Thermal Resistance and High Heat Transport Capability

Markus Winkler, David Rapp, Andreas Mahlke, Felix Zunftmeister, Marc Vergez, Erik Wischerhoff, Jürgen Clade, Kilian Bartholomé and Olaf Schäfer-Welsen
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Markus Winkler: Fraunhofer Institute for Physical Measurement Techniques IPM, Heidenhofstraße 8, 79110 Freiburg, Germany
David Rapp: Fraunhofer Institute for Physical Measurement Techniques IPM, Heidenhofstraße 8, 79110 Freiburg, Germany
Andreas Mahlke: Fraunhofer Institute for Physical Measurement Techniques IPM, Heidenhofstraße 8, 79110 Freiburg, Germany
Felix Zunftmeister: Fraunhofer Institute for Physical Measurement Techniques IPM, Heidenhofstraße 8, 79110 Freiburg, Germany
Marc Vergez: Fraunhofer Institute for Physical Measurement Techniques IPM, Heidenhofstraße 8, 79110 Freiburg, Germany
Erik Wischerhoff: Fraunhofer Institute for Applied Polymer Research IAP, Geiselbergstraße 69, 14476 Potsdam, Germany
Jürgen Clade: Fraunhofer Institute for Silicate Research ISC, Neunerpl. 2, 97082 Würzburg, Germany
Kilian Bartholomé: Fraunhofer Institute for Physical Measurement Techniques IPM, Heidenhofstraße 8, 79110 Freiburg, Germany
Olaf Schäfer-Welsen: Fraunhofer Institute for Physical Measurement Techniques IPM, Heidenhofstraße 8, 79110 Freiburg, Germany

Energies, 2020, vol. 13, issue 7, 1-16

Abstract: Electronics (particularly power electronics) are the core element in many energy-related applications. Due to the increasing power density of electronic parts, the demands on thermal management solutions have risen considerably. As a novel passive and highly efficient cooling technology, pulsating heat pipes (PHPs) can transfer heat away from critical hotspots. In this work, we present two types of small and compact PHPs with footprints of 50 × 100 mm 2 , thicknesses of 2 and 2.5 mm and with high fluid channel density, optimized for cooling electronic parts with high power densities. The characterization of these PHPs was carried out with a strong relation to practical applications, revealing excellent thermal properties. The thermal resistance was found to be up to 90% lower than that of a comparable solid copper plate. Thus, a hot part with defined heating power would remain at a much lower temperature level and, for the same heater temperature, a much larger heating power could be applied. Moreover, the dependence of PHP operation and thermal properties on water and air cooling, condenser area size and orientation is examined. Under some test configurations, dryout conditions are observed which could be avoided by choosing an appropriate size for the fluid channels, heater and condenser.

Keywords: pulsating heat pipes; oscillating heat pipes; cooling; heat transfer; thermal resistance; electronics cooling (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2020
References: View complete reference list from CitEc
Citations: View citations in EconPapers (2)

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