Multi-Wire Interconnection of Busbarless Solar Cells with Embedded Electrode Sheet

Jeong Eun Park, Won Seok Choi and Dong Gun Lim
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Jeong Eun Park: Department of Electronic Engineering, Korea National University of Transportation, Chungju 27909, Korea
Won Seok Choi: Department of IT Convergence, Korea National University of Transportation, Chungju 27909, Korea
Dong Gun Lim: Department of Electronic Engineering, Korea National University of Transportation, Chungju 27909, Korea

Energies, 2021, vol. 14, issue 13, 1-19

Abstract: The module technology proposed in this paper is used to fabricate a wire embedded ethyl vinyl acetate (EVA) sheet module by applying a cell/module integrated process in which the cell and wire are bonded during the lamination process. A wire-embedded EVA sheet module was fabricated using a busbarless cell and SnBiAg wire. As a result of the module characteristics corresponding to the lamination process temperature, the highest efficiency of 19.55% was observed at 170 °C. The lowest contact resistivity between the wire and the finger electrode was shown under a temperature condition of 170 °C, which was confirmed to increase the efficiency owing to an improvement of the fill factor with an excellent electrical contact.

Keywords: crystalline silicon solar cell; module; multi-wire; embedded EVA sheet; efficiency (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2021
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