A Topology Optimization Based Design of Space Radiator for Focal Plane Assemblies

Xiao Shen, Haitao Han, Yancheng Li, Changxiang Yan and Deqiang Mu
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Xiao Shen: Colledge of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China
Haitao Han: Colledge of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China
Yancheng Li: Colledge of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China
Changxiang Yan: Changchun Institue of Optics, Fine Mechanics and Physics (CIOMP), Chinese Academy of Sciences, Changchun 130033, China
Deqiang Mu: School of Mechanical and Electrical Engineering, Changchun University of Technology, Changchun 130033, China

Energies, 2021, vol. 14, issue 19, 1-15

Abstract: In this paper, to improve the heat dissipation efficiency of a radiator for focal plane assemblies, a topology optimization method is introduced into the design process. For the realization of the optimization, an objective of maximal thermal stiffness concerning the radiator is formulated. The topology optimization is performed under the same mass constraint of 2.05 kg as the initial design. To improve the manufacturability of topology optimization result, an inverse design is conducted to reconstruct a new model. In transient thermal simulation, the average maximal temperature on focal plane assemblies with a reconstructed radiator is 8.626 °C, while the average maximal temperature with the initial design is 9.793 °C. Compared to the initial design, a decrease of 1.167 °C on maximal temperature is achieved. As the heat dissipation efficiency of the proposed radiator design is improved compared to the initial design, it is meaningful in future applications.

Keywords: thermal design; optimization design; radiator; maximal thermal stiffness (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2021
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