Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling

Taha Baig, Zabdur Rehman, Hussain Ahmed Tariq, Shehryar Manzoor, Majid Ali, Abdul Wadood, Krzysztof Rajski and Herie Park
Additional contact information
Taha Baig: Department of Mechanical Engineering, Wah Engineering College, University of Wah, Wah Cantt 47040, Pakistan
Zabdur Rehman: Department of Mechanical Engineering, Air University Islamabad, Aerospace and Aviation Campus, Kamra 43570, Pakistan
Hussain Ahmed Tariq: Department of Mechanical Engineering, Institute of Space Technology, Islamabad 44000, Pakistan
Shehryar Manzoor: Department of Mechanical Engineering, University of Engineering and Technology Taxila, Taxila 47080, Pakistan
Majid Ali: Department of Mechanical Engineering, Wah Engineering College, University of Wah, Wah Cantt 47040, Pakistan
Abdul Wadood: Department of Electrical Engineering, Air University Islamabad, Aerospace and Aviation Campus, Kamra 43570, Pakistan
Krzysztof Rajski: Faculty of Environmental Engineering, Wroclaw University of Science and Technology, 50-370 Wrocław, Poland
Herie Park: Department of Electrical Engineering, Dong-A University, Busan 49315, Korea

Energies, 2021, vol. 14, issue 19, 1-15

Abstract: Due to high heat flux generation inside microprocessors, water-cooled heat sinks have gained special attention. For the durability of the microprocessor, this generated flux should be effectively removed. The effective thermal management of high-processing devices is now becoming popular due to high heat flux generation. Heat removal plays a significant role in the longer operation and better performance of heat sinks. In this work, to tackle the heat generation issues, a slotted fin minichannel heat sink (SFMCHS) was investigated by modifying a conventional straight integral fin minichannel heat sink (SIFMCHS). SFMCHSs with fin spacings of 0.5 mm, 1 mm, and 1.5 mm were numerically studied. The numerical results were then compared with SIFMCHSs present in the literature. The base temperatures recorded for two slots per fin minichannel heat sink (SPFMCHS), with 0.5 mm, 1 mm, and 1.5 mm fin spacings, were 42.81 °C, 46.36 °C, and 48.86 °C, respectively, at 1 LPM. The reductions in base temperature achieved with two SPFMCHSs were 9.20%, 8.74%, and 7.39% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, as compared to SIFMCHSs reported in the literature. The reductions in base temperature noted for three SPFMCHSs were 8.53%, 9.05%, and 5.95% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, at 1 LPM, as compared to SIFMCHSs reported in the literature. In terms of heat transfer performance, the base temperature and thermal resistance of the 0.5 mm-spaced SPFMCHS is better compared to 1 mm and 1.5 mm fin spacings. The uniform temperature distribution at the base of the heat sink was observed in all cases solved in current work.

Keywords: slotted fin minichannel heat sink; base temperature; thermal management; numerical simulation (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2021
References: View complete reference list from CitEc
Citations: View citations in EconPapers (1)

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