A Curvature Compensation Technique for Low-Voltage Bandgap Reference

Jie Shen, Houpeng Chen, Shenglan Ni and Zhitang Song
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Jie Shen: State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
Houpeng Chen: State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
Shenglan Ni: State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
Zhitang Song: State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China

Energies, 2021, vol. 14, issue 21, 1-12

Abstract: Based on the standard 40 nm Complementary Metal Oxide Semiconductor (CMOS) process, a curvature compensation technique is proposed. Two low-voltage, low-power, high-precision bandgap voltage reference circuits are designed at a 1.2 V power supply. By adding IPTAT (positive temperature coefficient current) and ICTAT (negative temperature coefficient current) to the output resistance, the first-order compensation bandgap voltages can be obtained. Meanwhile, the third high-order compensation current is also superimposed on the same resistance. We make use of the collector current of the bipolar transistor to compensate for the nonlinear term of V BE . The simulation results show that TC (temperature coefficient) of the first circuit reference could be reduced from 29.1 × 10 −6 /°C to 5.71 × 10 −6 /°C over the temperature range of −25 to 125 °C after temperature compensation. The second one could be reduced from 17 × 10 −6 /°C to 5.22 × 10 −6 /°C.

Keywords: bandgap reference; curvature compensation; nonlinear current (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2021
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