Thermal Performance of a Capacitive Comb-Drive MEMS Accelerometer: Measurements vs. Simulation

Mariusz Jankowski, Piotr Zając, Piotr Amrozik, Michał Szermer, Cezary Maj, Grzegorz Jabłoński and Jacek Nazdrowicz
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Mariusz Jankowski: Department of Microelectronics and Computer Science, Lodz University of Technology, 93-005 Lodz, Poland
Piotr Zając: Department of Microelectronics and Computer Science, Lodz University of Technology, 93-005 Lodz, Poland
Piotr Amrozik: Department of Microelectronics and Computer Science, Lodz University of Technology, 93-005 Lodz, Poland
Michał Szermer: Department of Microelectronics and Computer Science, Lodz University of Technology, 93-005 Lodz, Poland
Cezary Maj: Department of Microelectronics and Computer Science, Lodz University of Technology, 93-005 Lodz, Poland
Grzegorz Jabłoński: Department of Microelectronics and Computer Science, Lodz University of Technology, 93-005 Lodz, Poland
Jacek Nazdrowicz: Department of Microelectronics and Computer Science, Lodz University of Technology, 93-005 Lodz, Poland

Energies, 2021, vol. 14, issue 22, 1-22

Abstract: In this work, we analysed the difference between the measurement and simulation results of thermal drift of a custom designed capacitive MEMS accelerometer. It was manufactured in X-FAB XMB10 technology together with a dedicated readout circuit in X-FAB XP018 technology. It turned out that the temperature sensitivity of the sensor’s output is nonlinear and particularly strong in the negative Celsius temperature range. It was found that the temperature drift is mainly caused by the MEMS sensor and the influence of the readout circuit is minimal. Moreover, the measurements showed that this temperature dependence is the same regardless of applied acceleration. Simulation of the accelerometer’s model allowed us to estimate the contribution of post-manufacturing mismatch on the thermal drift; for our sensor, the mismatch-induced drift accounted for about 6% of total thermal drift. It is argued that the remaining 94% of the drift could be a result of the presence of residual stress in the structure after fabrication.

Keywords: MEMS accelerometer; capacitive sensor; integrated readout circuit; temperature drift; thermal measurements (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2021
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