Increasing Efficiency of a Finned Heat Sink Using Orthogonal Analysis

Bin Li, Zheng Cui, Qun Cao and Wei Shao
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Bin Li: Institute of Thermal Science and Technology, Shandong University, Jinan 250061, China
Zheng Cui: Institute of Thermal Science and Technology, Shandong University, Jinan 250061, China
Qun Cao: Shandong Institute of Advanced Technology, Jinan 250100, China
Wei Shao: Institute of Thermal Science and Technology, Shandong University, Jinan 250061, China

Energies, 2021, vol. 14, issue 3, 1-15

Abstract: As the heat flux of electronic components is increasing rapidly, the traditional air-cooling technique is gradually not meeting the requirements of thermal management. The immersion liquid-cooling technique shows great potential, and has attracted increasing attention due to its excellent performance in recent years. The finned heat sink is common and essential for cooling electric components. To analyze the influences of its structural parameters on heat dissipation and improve its efficiency while using a dielectric coolant, this study used the orthogonal analysis method to obtain the optimal structure via the numerical simulation method. The maximum temperature of the heat sink was selected as the evaluation criteria. The results showed that the parameters that affect the maximum temperature, in order of importance, are fin thickness, the number of fins, the height of the fins, and substrate thickness. Finally, taking the maximum temperature and mass as indexes obtained the optimal structure of the heat sink. The mass was reduced by 19%, while the temperature only increased by 4.5% when considering the mass index.

Keywords: heat sink; orthogonal analysis method; numerical simulation (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2021
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (1)

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