Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl and Alfred Binder
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Ali Roshanghias: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
Perla Malago: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
Jaroslaw Kaczynski: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
Timothy Polom: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
Jochen Bardong: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
Dominik Holzmann: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
Muhammad-Hassan Malik: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
Michael Ortner: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
Christina Hirschl: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
Alfred Binder: Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria

Energies, 2021, vol. 14, issue 8, 1-13

Abstract: Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages.

Keywords: power packaging; clip bonding; sinter paste; copper paste; planar interconnects; wire-bondless packaging; top-side interconnects; front-side interconnects; sinterconnects (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2021
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