Cooling Systems of Power Semiconductor Devices—A Review

Krzysztof Górecki and Krzysztof Posobkiewicz
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Krzysztof Górecki: Department of Marine Electronics, Gdynia Maritime University, 81-225 Gdynia, Poland
Krzysztof Posobkiewicz: Department of Marine Electronics, Gdynia Maritime University, 81-225 Gdynia, Poland

Energies, 2022, vol. 15, issue 13, 1-29

Abstract: In this paper, a detailed review of contemporary cooling systems of semiconductor devices is presented. The construction and the principles of operation of selected components of passive and active cooling systems, as well as selected computer tools supporting the design of such systems, are described. The dependences of thermal parameters calculated using these tools on selected factors characterizing the used cooling systems, e.g., the dimensions of their components, are presented and discussed. Additionally, some results of measurements illustrating the influence of selected parameters on the thermal resistance of power MOSFETs mounted in different cooling systems are shown. The properties of selected cooling systems are compared, and it is shown that by changing the type of cooling system, it is possible to reduce the thermal resistance value of a power MOSFET even 20 times. The presented considerations can make the process of designing cooling systems more effective.

Keywords: thermal resistance; transient thermal impedance; thermal parameters; cooling systems; thermal phenomena; self heating; power semiconductor devices (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2022
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (3)

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