Thermal Performance Analysis of Various Heat Sinks Based on Alumina NePCM for Passive Cooling of Electronic Components: An Experimental Study

Imran Zahid, Muhammad Farooq (), Muhammad Farhan (), Muhammad Usman, Adnan Qamar, Muhammad Imran (), Mejdal A. Alqahtani, Saqib Anwar, Muhammad Sultan and Muhammad Yasar Javaid
Additional contact information
Imran Zahid: Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan
Muhammad Farooq: Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan
Muhammad Farhan: Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan
Muhammad Usman: Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan
Adnan Qamar: Department of Mechanical Engineering, University of Engineering and Technology, Lahore 39161, Pakistan
Muhammad Imran: Department of Mechanical, Biomedical and Design Engineering, College of Engineering and Physical Sciences, Aston University, Birmingham B4 7ET, UK
Mejdal A. Alqahtani: Industrial Engineering Department, College of Engineering, King Saud University, P.O. Box 800, Riyadh 11421, Saudi Arabia
Saqib Anwar: Industrial Engineering Department, College of Engineering, King Saud University, P.O. Box 800, Riyadh 11421, Saudi Arabia
Muhammad Sultan: Department of Agricultural Engineering, Bahauddin Zakariya University, Multan 60800, Pakistan
Muhammad Yasar Javaid: Department of Mechanical Engineering and Technology, Government College University, Faisalabad 38000, Pakistan

Energies, 2022, vol. 15, issue 22, 1-16

Abstract: In the modern digital world, electronic devices are being widely employed for various applications where thermal performance represents a significant technical challenge due to continued miniaturization, high heat generated in the system, and non-uniform high-temperature causing failure. Phase change materials (PCMs) owing to the immense heat of fusion are primarily considered for thermal management, but their insulating properties hedge their applications in electronics cooling. Nano-enhanced phase change materials (NePCMs) have the ability to improve the thermal conductivity of PCM, decrease system temperature and escalate the operating time of devices. Accordingly, the current study focused on the experimental investigations for the thermal performance of three heat sinks (HS) with different configurations such as a simple heat sink (SHS), a square pin-fins heat sink (S pf HS), and Cu foam integrated heat sink (Cu fm HS) with various alumina nanoparticles mass concentrations (0.15, 0.20 and 0.25 wt%) incorporated in PCM (RT-54HC) and at heat flux (0.98–2.94 kW/m 2 ). All HSs reduced the base temperature with the insertion of NePCM compared to the empty SHS. The experimental results identified that the thermal performance of Cu fm HS was found to be superior in reducing base temperature and enhancing working time at two different setpoint temperatures (SPTs). The maximum drop in base temperature was 36.95%, and a 288% maximum working time enhancement was observed for Cu fm HS. Therefore, NePCMs are highly recommended for the thermal management of the electronic cooling system.

Keywords: nano-enhanced phase change material; simple heat sink; square pin-fin heat sink; copper foam; heat flux; thermal management (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2022
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (3)

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