Experimental Investigations of the LED Lamp with Heat Sink Inside the Synthetic Jet Actuator

Paweł Gil (), Joanna Wilk, Slawomir Smolen, Rafał Gałek, Marek Markowicz and Piotr Kucharski
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Paweł Gil: Faculty of Mechanical Engineering and Aeronautics, Rzeszow University of Technology, al. Powstańców Warszawy 8, 35-959 Rzeszów, Poland
Joanna Wilk: Faculty of Mechanical Engineering and Aeronautics, Rzeszow University of Technology, al. Powstańców Warszawy 8, 35-959 Rzeszów, Poland
Slawomir Smolen: Faculty of Nature and Engineering, J.R. Mayer–Institute for Energy Engineering, City University of Applied Sciences Bremen, Neustadtswall 30, 28199 Bremen, Germany
Rafał Gałek: Faculty of Mechanical Engineering and Aeronautics, Rzeszow University of Technology, al. Powstańców Warszawy 8, 35-959 Rzeszów, Poland
Marek Markowicz: Doctoral School of Engineering and Technical Sciences, Rzeszow University of Technology, al. Powstańców Warszawy 12, 35-959 Rzeszów, Poland
Piotr Kucharski: LUXON Company, ul. Kwiatowa 45, 55-330 Krępice, Poland

Energies, 2022, vol. 15, issue 24, 1-19

Abstract: The paper presents the experimental research on the thermal management of a 150 W LED lamp with heat sink inside a synthetic jet actuator. The luminous flux was generated by 320 SMD LEDs with a nominal luminous efficacy equal to 200 lm/W mounted on a single PCB. Characteristic temperatures were measured with three different measurement techniques: thermocouples, infrared camera, and an estimation of the junction temperature from its calibrated dependence on the LED forward voltage. The temperature budget between the LED junction and ambient as well as the thermal resistance network was determined and analyzed. The energy balance of the LED lamp is presented along with the values of the heat flow rate and heat transfer coefficient in different regions of the LED lamp surface. For an input power supplied to the SJA equal to 4.50 W, the synthetic jet dissipated approximately 89% of the total heat generated by the LED lamp. The heat from the PCB was transferred through the front and rear surfaces of the board. For the input power of 4.50 W, approximately 91% of the heat generated by LEDs was conducted by the PCB substrate to the heat spreading plate, while the remaining 9% was dissipated by the front surface of the PCB, mostly by radiation. The thermal balance revealed that for the luminous efficacy of the investigated LEDs, approximately 60% of the electrical energy supplied to the LED lamp was converted into heat, while the rest was converted into light.

Keywords: LED; thermal management; synthetic jet; heat transfer coefficient (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2022
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