Comparative Thermal Performances between Pumped Thermosyphon Loops with Different Condenser Configurations Using R245fa as Working Fluid

Shyy-Woei Chang, Yn-An Tsai and Cheng-Lin Tsai
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Shyy-Woei Chang: Department of Systems and Naval Mechatronic Engineering, National Cheng Kung University, No. 1, University Road, Tainan City 70101, Taiwan
Yn-An Tsai: Department of Systems and Naval Mechatronic Engineering, National Cheng Kung University, No. 1, University Road, Tainan City 70101, Taiwan
Cheng-Lin Tsai: Department of Systems and Naval Mechatronic Engineering, National Cheng Kung University, No. 1, University Road, Tainan City 70101, Taiwan

Energies, 2022, vol. 15, issue 2, 1-32

Abstract: A pumped two-phase thermosyphon loop is broadly utilized to intensify the cooling duties of electronic chipsets/systems and the effectiveness for harvesting thermal energy. The configuration of a condenser not only affects the heat transfer in the condenser, but also has an effect on the saturation pressures during the boiling and condensation processes to alter the hydrothermal performance of a pumped thermosyphon loop. The influence of the condenser configuration on the hydrothermal performance of a pumped thermosyphon loop is rarely studied. The present study comparatively examined the thermal performances of two pumped thermosyphon loops with a conventional tube-fin condenser and the expansion-tank condenser. The thermodynamic cycles in pressure-temperature and pressure-enthalpy diagrams, Nusselt numbers of evaporator and condenser, thermal resistances and various performance indexes evaluated at constant pumping powers at the controlled through-flow Reynolds numbers, boiling numbers and condenser thermal resistances were measured. At the similar thermal loads, flow rates, and fluid entry temperatures of condenser, the operating pressure of the thermosyphon loop with expansion tank condenser was considerably reduced from that with tube fin condenser, leading to the lower saturation temperature for reducing the thermal resistance and the lesser pressure drop across the loop with a noticeable hydrothermal performance improvement. At the parametric conditions tested, the ratio of dimensionless overall thermal resistances between the loops with expansion tank condenser and tube fin condenser fell in the range of 0.81–0.99. When the loop performance was compared at a constant cooling airflow rate without considering the more pumping power consumption for the loop with tube fin condenser, the ranges of thermal resistance for the loops with expansion tank condenser and tube fin condenser were 0.13–0.21 (KW −1 ) and 0.15–0.23 (KW −1 ). The merit indices evaluating the comparative hydrothermal performances of evaporator, condenser and loop between the two looped thermosyphons highlighted the significance of condenser design and affirmed the performance improvement by changing tube fin condenser into expansion tank condenser. The empirical correlations of evaporator Nusselt number, condenser Nusselt number, and overall thermal resistance using Reynolds number, boiling number, and condenser thermal resistance as the controlling parameters were generated for relevant applications.

Keywords: pumped loop thermosyphon; expansion tank condenser; data center cooling (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2022
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