Enhancement Effect of a Diamond Network on the Flow Boiling Heat Transfer Characteristics of a Diamond/Cu Heat Sink

Nan Wu, Mingmei Sun (), Hong Guo (), Zhongnan Xie and Shijie Du
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Nan Wu: State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China
Mingmei Sun: State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China
Hong Guo: State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China
Zhongnan Xie: State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China
Shijie Du: State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China

Energies, 2023, vol. 16, issue 21, 1-17

Abstract: The use of a micro heat sink is an effective means of solving the problem of high-power chip heat dissipation. Diamond/Cu composites exhibit high thermal conductivity and a linear thermal expansion coefficient that is compatible with semiconductor materials, rendering them ideal micro heat sink materials. The aim of this study was to fabricate diamond/Cu and Cu separately as heat sinks and subject them to flow boiling heat transfer experiments. The results indicate that the diamond/Cu heat sink displayed a decrease in wall superheat of 10.2–14.5 °C and an improvement in heat transfer coefficient of 38–51% compared with the Cu heat sink under identical heat fluxes. The heat sink also exhibits enhanced thermal uniformity. Secondary diamond particles are incorporated into the gaps of the main diamonds, thereby constructing a three-dimensional heat conduction network within the composite material. The diamond network enhances the internal heat flux of the material while also creating more nucleation sites on the surface. These increase the boiling intensity of the diamond/Cu heat sink, leading to better heat transfer performance. By combining the transient thermal model with computational fluid dynamics, a heat transfer model based on the diamond/Cu heat sink is proposed. The efficient heat dissipation capability of diamond/Cu heat sinks can lower the working temperature of microelectronic devices, thereby improving device performance and reliability during operation.

Keywords: diamond/Cu; heat conduction network; heat transfer; flow boiling; computational fluid dynamics (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2023
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