Experimental Determination of Thermal Couplings in Packages Containing Multiple LEDs

Marcin Janicki (), Przemysław Ptak, Tomasz Torzewicz and Krzysztof Górecki
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Marcin Janicki: Department of Microelectronics and Computer Science, Lodz University of Technology, 90-924 Lodz, Poland
Przemysław Ptak: Department of Marine Electronics, Gdynia Maritime University, 81-225 Gdynia, Poland
Tomasz Torzewicz: Department of Microelectronics and Computer Science, Lodz University of Technology, 90-924 Lodz, Poland
Krzysztof Górecki: Department of Marine Electronics, Gdynia Maritime University, 81-225 Gdynia, Poland

Energies, 2023, vol. 16, issue 4, 1-8

Abstract: Light Emitting Diodes (LEDs) are the most commonly used light sources. Temperature strongly affects their operation. Considering that multiple devices are often placed in a single housing, thermal couplings between devices become important. This problem is illustrated here based on the example of a light source containing four LEDs in a single package. Thermal analyses are carried out based on measured transient temperature responses. The measurement results are processed employing the Network Identification by Deconvolution method. The obtained results demonstrate clearly that depending on the device mounting manner and applied cooling condition the temperature rise value induced in neighboring devices can exceed 70% of the rise in the heating diode. Consequently, thermal models of such LEDs should consider not only self-heating effects, but also thermal interactions with the other diodes.

Keywords: LEDs; thermal modeling; dynamic temperature response (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2023
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