Small-Scale Phase Change Materials in Low-Temperature Applications: A Review

Leland Weiss () and Ramanshu Jha
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Leland Weiss: Institute for Micromanufacturing, College of Engineering and Science, Louisiana Tech University, Ruston, LA 71272, USA
Ramanshu Jha: Institute for Micromanufacturing, College of Engineering and Science, Louisiana Tech University, Ruston, LA 71272, USA

Energies, 2023, vol. 16, issue 6, 1-24

Abstract: Significant efforts have explored the field of Phase Change Materials (PCMs) for various applications. Research and real-world applications explore length scales that range from infrastructure to micro systems. A commonality of these efforts is the desire to utilize the phase change capability of the PCM to provide a steady temperature heat sink for thermal storage. Smaller scale efforts and materials are presented in this present review. A general challenge to the use of these PCMs regardless of application is the low thermal conductivity present as a baseline material property. Efforts to improve thermal conductivity have included the addition of underlying metal foam structures, heat pipes, or metallic fins inserted into the base PCM. Other efforts have investigated alterations to the base materials themselves by employing additives such as graphite to supplement thermal performance. Other additives are used to obtain form stability in the PCM as it melts. While the field of PCM research has been well established, the use of new materials and approaches that employ the use of natural materials continues to move research forward. This review captures significant efforts and presents a thoughtful comparison of common themes across centimeter and smaller-scale PCM use.

Keywords: form stability; heat sink; material additives; micro; nano; PCM; temperature control; thermal energy storage; sustainability (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2023
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