Numerical Analysis of Flow Boiling Characteristics of a Single Channel Heat Sink Subjected to Multiple Heat Sources

Jiyu Qian, Rui Wang, Tao Wei, Hao Tang and Dinghua Hu ()
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Jiyu Qian: Nanjing Research Institute of Electronics Technology, Nanjing 210094, China
Rui Wang: Nanjing Research Institute of Electronics Technology, Nanjing 210094, China
Tao Wei: Nanjing Research Institute of Electronics Technology, Nanjing 210094, China
Hao Tang: MIIT Key Laboratory of Thermal Control of Electronic Equipment, School of Energy and Power Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
Dinghua Hu: MIIT Key Laboratory of Thermal Control of Electronic Equipment, School of Energy and Power Engineering, Nanjing University of Science and Technology, Nanjing 210094, China

Energies, 2023, vol. 16, issue 7, 1-16

Abstract: High-power electronic devices with multiple heat sources often require temperature uniformity and to operate within their functional temperature range for optimal performance. Micro-channel cooling could satisfy the heat dissipation requirements, but it may cause temperature non-uniformity. In this paper, simulations are performed for different geometric parameters of the channel and the position of the heat source. The results show that a flattened channel can effectively reduce the heat source temperature, broadening the straight channel can reduce the flow resistance and enhance heat transfer, while widening the channel at the bend may lead to local dryness. Meanwhile, a thermal model is established to analyze the influence of the position of the heat source. The results also show that with the increase in the curved channel radius, the phenomenon of vapor–liquid separation becomes more obvious, the pressure drop decreases, but the heat transfer effect worsens.

Keywords: numerical simulations; heat transfer enhancement; performance analysis; two-phase flow (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2023
References: View complete reference list from CitEc
Citations: View citations in EconPapers (1)

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