Model-Based Thermal Stress and Lifetime Estimation of DFIG Wind Power Converter

Xinming Yu (), Francesco Iannuzzo and Dao Zhou ()
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Xinming Yu: Department of Energy, Aalborg University, DK-9220 Aalborg, Denmark
Francesco Iannuzzo: Department of Energy, Aalborg University, DK-9220 Aalborg, Denmark
Dao Zhou: Department of Energy, Aalborg University, DK-9220 Aalborg, Denmark

Energies, 2024, vol. 17, issue 14, 1-15

Abstract: Turbine systems equipped with doubly fed induction generation (DFIG) are becoming increasingly vital in wind power generation, with the reliability of the devices serving as a pillar in the industrial sector. Thermal stress and lifetime assessment are fundamental indicators in this regard. This paper primarily addresses the thermal stress and lifespan of power semiconductor devices utilized in a DFIG grid-side converter (GSC) and rotor-side converter (RSC). PLECS (Piecewise Linear Electrical Circuit Simulation) is employed to validate the electrical and thermal stress of the power devices. Additionally, Ansys Icepak, a finite element analysis (FEA) software, is utilized to confirm temperature fluctuations under various operations. The power consumption and junction temperature of the power devices in the GSC and RSC of a 2 MW DFIG are compared. It is evident that the most stressed power semiconductor is the IGBT for the GSC with a temperature swing of 3.4 °C, while the diode in the RSC is the most stressed with a temperature swing of 10.1 °C. This paper also presents a lifetime model to estimate the lifespan of the power device based on the annual wind profile. By considering the annual mission profile, we observe that the lifetime of the back-to-back power converter is limited by the diode of the RSC, whose B 10 lifetime is calculated at 15 years.

Keywords: doubly fed induction generation; grid-side converter; lifetime; rotor-side converter; thermal stress emulation; finite element analysis; lifetime (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2024
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