Numerical Study on Heat Transfer Efficiency and Inter-Layer Stress of Microchannel Heat Sinks with Different Geometries

Fangqi Liu, Lei Jia (), Jiaxin Zhang, Zhendong Yang, Yanni Wei, Nannan Zhang and Zhenlin Lu
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Fangqi Liu: School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China
Lei Jia: School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China
Jiaxin Zhang: School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China
Zhendong Yang: State Key Laboratory of Eco-Hydraulics in Northwest Arid Region of China, Xi’an University of Technology, Xi’an 710048, China
Yanni Wei: School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China
Nannan Zhang: School of Materials Science and Engineering, Shenyang University of Technology, Shenyang 110870, China
Zhenlin Lu: School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China

Energies, 2024, vol. 17, issue 20, 1-21

Abstract: As electronics become more powerful and compact, laminated microchannel heat sinks (MCHSs) are essential for handling high heat flux. This study aims to optimize the MCHS design for improved heat dissipation and structural strength. An orthogonal experiment was established with the average surface temperature of the heat source as the evaluation metric, and the optimal structure was determined through simulation. Finally, cooling uniformity, fluidity, and performance evaluation criterion ( PEC ) analyses were carried out on the optimal structure. It was determined that the optimal combination was the triangular cavity microchannel (MCTC), with a microchannel width of 0.5 mm, a microchannel distribution density of 60%, and the presence of surface undulation on the microchannels. The result shows that the optimal structure’s peak inter-layer stress is just 34.8% of its longitudinal tensile strength. Compared to the traditional parallel straight microchannel (MCPS), this structure boasts an 8.6 K decrease in the average surface temperature and a temperature variation along specific paths that is only 9.9% of that in traditional designs. Moreover, the optimal design cuts the velocity loss at the microchannel entrance from 75% to 59%. Thus, this research successfully develops an effective optimization strategy for MCHSs.

Keywords: microchannel heat sink; heat transfer; stress distribution; stainless steel; numerical simulation (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2024
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