Power Loss and Electrothermal Characterization of Hybrid Power Integrated Modules for Industrial Servo Motor Drives

Hsien-Chie Cheng (), Yan-Cheng Liu, Wen-You Jhu, Po-Kai Chiu, Tao-Chih Chang and Kuo-Ning Chiang ()
Additional contact information
Hsien-Chie Cheng: Department of Aerospace and Systems Engineering, Feng Chia University, Taichung 407, Taiwan
Yan-Cheng Liu: Electronic & Optoelectronic System Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan
Wen-You Jhu: Ph.D Program of Mechanical and Aeronautical Engineering, Feng Chia University, Taichung 407, Taiwan
Po-Kai Chiu: Electronic & Optoelectronic System Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan
Tao-Chih Chang: Electronic & Optoelectronic System Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan
Kuo-Ning Chiang: Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan

Energies, 2024, vol. 17, issue 23, 1-22

Abstract: This study aims to facilitate the assessment of the electromagnetic-electrical-thermal coupled response of a developed 30 kHz/12 kW silicon carbide (SiC)/silicon (Si) hybrid power-integrated module ( h PIM) during load operation. To achieve this goal, an efficient electromagnetic-circuit-thermal coupling (ECTC) analysis methodology is introduced. This ECTC methodology incorporates a fully integrated electromagnetic-circuit coupling (EMCC) analysis model for parasitic extraction in order to addressing their effects on power losses, and a simplified electrothermal coupling (SETC) analysis model for temperature evaluation in order to consider the coupling influence of the instantaneous junction temperature on instantaneous power losses. The SETC model couples a simple lookup table that maps the power loss (P) in terms of the temperature (T) constructed using the developed EMCC model, and an equivalent Foster thermal network model established through three-dimensional (3D) computational fluid dynamics (CFD) thermal flow analysis. This PT lookup table, replacing the tedious and time-consuming EMCC simulation, is responsible for fast estimation of temperature-dependent power losses. The proposed analysis models, namely the CFD, EMCC, and SETC analysis models, are validated through thermal experiments and detailed modeling. Finally, the influence of various operation conditions on the power losses of the h PIM during the power conversion operation is explored through parametric analysis.

Keywords: hybrid power-integrated module; SiC metal-oxide semiconductor field effect transistor inverter; Si rectifier diode; power loss; parasitic effect; switching transient; electrothermal coupled behavior (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2024
References: View references in EconPapers View complete reference list from CitEc
Citations:

Downloads: (external link)
https://www.mdpi.com/1996-1073/17/23/6036/pdf (application/pdf)
https://www.mdpi.com/1996-1073/17/23/6036/ (text/html)

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:gam:jeners:v:17:y:2024:i:23:p:6036-:d:1534000

Access Statistics for this article

Energies is currently edited by Ms. Agatha Cao

More articles in Energies from MDPI
Bibliographic data for series maintained by MDPI Indexing Manager ().