Experimental and Numerical Study of the Heat Dissipation of the Electronic Module in an Air Conditioner Outdoor Unit

Yi Peng, Su Du, Qingfeng Bie, Dechang Wang (), Qinglu Song and Sai Zhou
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Yi Peng: College of Mechanical and Electrical Engineering, Qingdao University, 308 Ningxia Road, Qingdao 266071, China
Su Du: China United Network Communications Corporation, Yantai Branch, 318 Shengli Road, Yantai 264000, China
Qingfeng Bie: Hisense Air Conditioner Co., Ltd., Hisense R & D Center, 399 Songling Road, Qingdao 266104, China
Dechang Wang: College of Mechanical and Electrical Engineering, Qingdao University, 308 Ningxia Road, Qingdao 266071, China
Qinglu Song: College of Mechanical and Electrical Engineering, Qingdao University, 308 Ningxia Road, Qingdao 266071, China
Sai Zhou: College of Mechanical and Electrical Engineering, Qingdao University, 308 Ningxia Road, Qingdao 266071, China

Energies, 2025, vol. 18, issue 10, 1-19

Abstract: Effective thermal management of electronic modules is crucial to the reliable operation of variable frequency air conditioners. For this reason, two types of plate-finned heat sinks of electronic modules were selected. The experiments utilized ceramic heating plates to simulate chip heating, conducted in an enthalpy difference laboratory with controlled environments. Four installation cases were analyzed to evaluate the impact of heat sink orientation, airflow direction, and structural layout. The results showed that when multiple chips were arranged on the same heat dissipation substrate, the heat dissipation process of the chips would be coupled with each other, and the rational layout of the chips played an important role in heat dissipation. In the case of cooling air impacting the jet, the heat dissipation performance of the heat sink was significantly improved, and the heat transfer coefficient of the heat sink was as high as 316.5 W·m −2 ·°C −1 , representing a 6.9% improvement over conventional designs (case I: 296.1 W·m⁻ 2 ·°C⁻ 1 ). The maximum temperature of the chips could be reduced by 11.1%, which is 10.1 °C lower. This study will provide a reference for the optimization design of the heat sink of the electric control module in inverter air conditioners.

Keywords: plate-finned heat sink; heat transfer coefficient; forced air cooling; electronic module; heat dissipation; variable frequency air conditioner (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2025
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