Magnetron-Sputtered and Rapid-Thermally Annealed NiO:Cu Thin Films on 3D Porous Substrates for Supercapacitor Electrodes

Seongha Oh, Young-Kil Jun and Nam-Hoon Kim ()
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Seongha Oh: Department of Electrical Engineering, Chosun University, Gwangju 61452, Republic of Korea
Young-Kil Jun: Hydrogen Industry Team, Green Energy Institute, Mokpo 58656, Republic of Korea
Nam-Hoon Kim: Department of Electrical Engineering, Chosun University, Gwangju 61452, Republic of Korea

Energies, 2025, vol. 18, issue 11, 1-13

Abstract: The performance of NiO-based supercapacitor electrodes for energy storage systems was enhanced by doping Cu into NiO thin films (200 nm) using radio-frequency magnetron co-sputtering on 3D porous Ni foam substrates, followed by rapid thermal annealing. The Hall effect measurements demonstrated enhanced electrical conductivity, with resistivity values of 1.244 × 10 −4 Ω·cm. The 3D porous NiO:Cu electrodes significantly increased the specific capacitance and achieved a value of 1809.2 Fg −1 , with the NiO:Cu (10 at% Cu) thin films at a scan rate of 5 mVs −1 , which is a 2.67-fold increase compared with the undoped NiO films on a glass substrate. The 3D porous NiO:Cu electrodes significantly improved the electrochemical properties of the NiO-based electrode, which resulted in a higher specific capacitance for enhancing the energy storage performance during grid stabilization.

Keywords: NiO thin films; supercapacitor electrode; RF sputtering; Cu doping; Ni foam (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2025
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