Research on Thermal Performance of the Microchannel with Internal Cavities Under Al 2 O 3 -Water Nanofluid

Fang Li, Zewen Tan, Hu He, Youhang Zhou (), Xuan Tang () and Wenhui Zhu ()
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Fang Li: School of Mechanical Engineering and Mechanics, Xiangtan University, Xiangtan 411105, China
Zewen Tan: School of Mechanical Engineering and Mechanics, Xiangtan University, Xiangtan 411105, China
Hu He: College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
Youhang Zhou: School of Mechanical Engineering and Mechanics, Xiangtan University, Xiangtan 411105, China
Xuan Tang: School of Mechanical Engineering and Mechanics, Xiangtan University, Xiangtan 411105, China
Wenhui Zhu: College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China

Energies, 2025, vol. 18, issue 16, 1-18

Abstract: As the demand for efficient heat dissipation in information devices continues to escalate, the heat flux of integrated packaging devices is poised to reach 100 W/cm 2 universally, rendering microchannel liquid cooling technology a pivotal solution in thermal management. In this work, the microchannel heat sink with spoiler cavities, optimized via field synergy principle, was integrated into the high-power electronics, and its flow and heat transfer performance were experimentally investigated using Al 2 O 3 -water nanofluid. The results show that the experimental and simulation results of the optimized microchannel heat sink integrated with IGBT devices are in good agreement. With structural optimization combined with an appropriate volume fraction of nanofluid, the microchannel heat sink exhibited significantly better heat dissipation performance than that of rectangular heat sinks under a heat flux of 100 W/cm 2 . Furthermore, when the volumetric flow rate exceeded 0.6 mL/s, the heat transfer performance was improved by 38% compared to the rectangular microchannel heat sink with 1% volume fraction of Al 2 O 3 -water nanofluid.

Keywords: field synergy principle; heat transfer enhancement; microchannel embedded IGBT; nanofluids (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2025
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