Numerical Study on Optimization of Manifold Microchannel Heat Sink

Jiajun Zhou, Jinfeng Chen, Qing Wang, Xianli Xie (), Penghui Guan and Huai Zheng ()
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Jiajun Zhou: State Key Laboratory of Intelligent Vehicle Safety Technology, Chongqing Changan Automobile Company Limited, Chongqing 400023, China
Jinfeng Chen: School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China
Qing Wang: School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
Xianli Xie: State Key Laboratory of Intelligent Vehicle Safety Technology, Chongqing Changan Automobile Company Limited, Chongqing 400023, China
Penghui Guan: State Key Laboratory of Intelligent Vehicle Safety Technology, Chongqing Changan Automobile Company Limited, Chongqing 400023, China
Huai Zheng: School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China

Energies, 2025, vol. 18, issue 22, 1-12

Abstract: Integrated circuits have become indispensable in modern society owing to their formidable computational power and high integration, finding extensive applications in critical fields such as artificial intelligence and new energy vehicles. However, continued increases in integration density and reductions in physical size lead to a significantly higher heat flux density, thereby posing major challenges for thermal management and overall chip reliability. To address these thermal challenges, this study introduces an optimized manifold microchannel design. A three-dimensional conjugate heat transfer model was developed, and computational fluid dynamics simulations were performed to analyze the thermal–hydraulic performance. To mitigate temperature non-uniformity, several strategies were implemented: adjusting channel widths, employing uneven inlet gaps, and incorporating micro-fins. Results demonstrate that the optimized configuration achieves a maximum temperature reduction of 7.7 K, with peak thermal stress decreasing from 55.29 MPa to 47 MPa, effectively improving temperature uniformity. This study confirms that the proposed optimized design significantly enhances overall thermal performance, thereby offering a reliable and effective strategy for advanced chip thermal management.

Keywords: chip heat dissipation; manifold microchannel; numerical simulation (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2025
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