Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method

José Vallepuga-Espinosa, Jaime Cifuentes-Rodríguez, Víctor Gutiérrez-Posada and Iván Ubero-Martínez
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José Vallepuga-Espinosa: Departamento de Tecnología Minera, Topográfica y de Estructuras, Universidad de León, Campus de Vegazana, s/n, 24071 León, Spain
Jaime Cifuentes-Rodríguez: Departamento de Tecnología Minera, Topográfica y de Estructuras, Universidad de León, Campus de Vegazana, s/n, 24071 León, Spain
Víctor Gutiérrez-Posada: Departamento de Tecnología Minera, Topográfica y de Estructuras, Universidad de León, Campus de Vegazana, s/n, 24071 León, Spain
Iván Ubero-Martínez: Departamento de Tecnología Minera, Topográfica y de Estructuras, Universidad de León, Campus de Vegazana, s/n, 24071 León, Spain

Mathematics, 2022, vol. 10, issue 11, 1-30

Abstract: This paper presents a simulation based on the boundary element method for the optimization of the thermomechanical behavior of three-dimensional microchip-dissipator packaging when the heat generation produced is medium-low. Starting from a basic architecture studied in the literature, different modifications affecting both elastic boundary conditions and the contact interface between the microprocessor and the heatsink are included and studied in order to improve heat dissipation. A nonlinear interface material is included at the interface of both solids. Thus, a thermal contact conductance as a function of the normal contact traction is simulated. Finally, all these improvements in both contact interface and boundary conditions are applied to study the maximum heat generation that this kind of architecture can efficiently dissipate, so that the microchip will not be damaged due to thermal deformations.

Keywords: boundary element method; elastic contact problem; thermoelastic contact problem; microelectronic packaging; variable thermal contact resistance; thermal interface material (search for similar items in EconPapers)
JEL-codes: C (search for similar items in EconPapers)
Date: 2022
References: View complete reference list from CitEc
Citations: View citations in EconPapers (1)

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