EconPapers    
Economics at your fingertips  
 

A Note on a Modified Parisian Ruin Concept

Eric C. K. Cheung () and Jeff T. Y. Wong
Additional contact information
Eric C. K. Cheung: School of Risk and Actuarial Studies, UNSW Business School, University of New South Wales, Sydney, NSW 2052, Australia
Jeff T. Y. Wong: Department of Statistics and Actuarial Science, The University of Hong Kong, Pokfulam Road, Hong Kong

Risks, 2023, vol. 11, issue 3, 1-15

Abstract: Traditionally, Parisian ruin is said to occur when the insurer’s surplus process has stayed below level zero continuously for a certain grace period. Inspired by this concept, in this paper we propose a modification by assuming that once a grace period has been granted when the surplus becomes negative, the surplus level will not be monitored continuously in the interim, but instead it will be checked at the end of the grace period to see whether the business has recovered. Under an Erlang distributed grace period, a computationally tractable formula for the Gerber–Shiu expected discounted penalty function is derived. Numerical examples regarding the modified Parisian ruin probability are also provided.

Keywords: compound poisson process; Parisian ruin; Erlangization; Gerber–Shiu function; discounted density (search for similar items in EconPapers)
JEL-codes: C G0 G1 G2 G3 K2 M2 M4 (search for similar items in EconPapers)
Date: 2023
References: View references in EconPapers View complete reference list from CitEc
Citations:

Downloads: (external link)
https://www.mdpi.com/2227-9091/11/3/56/pdf (application/pdf)
https://www.mdpi.com/2227-9091/11/3/56/ (text/html)

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:gam:jrisks:v:11:y:2023:i:3:p:56-:d:1092842

Access Statistics for this article

Risks is currently edited by Mr. Claude Zhang

More articles in Risks from MDPI
Bibliographic data for series maintained by MDPI Indexing Manager ().

 
Page updated 2025-03-19
Handle: RePEc:gam:jrisks:v:11:y:2023:i:3:p:56-:d:1092842