The Effects of Hot Blocks Geometry and Particle Migration on Heat Transfer and Entropy Generation of a Novel I-Shaped Porous Enclosure

Ramin Ghasemiasl, Maysam Molana, Taher Armaghani and Mohsen Saffari Pour
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Ramin Ghasemiasl: Department of Mechanical Engineering, West Tehran Branch, Islamic Azad University, Tehran 14687-63785, Iran
Maysam Molana: Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202, USA
Taher Armaghani: Department of Mechanical Engineering, Mahdishahr Branch, Islamic Azad University, Mahdishahr 35618-75915, Iran
Mohsen Saffari Pour: Department of Mechanical Engineering, Faculty of Engineering, Shahid Bahonar University of Kerman, Kerman 76169-13439, Iran

Sustainability, 2021, vol. 13, issue 13, 1-19

Abstract: This paper studied the cooling performance of a hot electronic chip using nanofluids (NF) mixed convection, implementing Buongiorno’s model of the NF simulation. The NF were assumed water-Al 2 O 3 nanoparticles (NP) in the range of 0 to 4% of volume concentration. Six different problems of the combinations of three internal hot blocks, including triangular, square, and circular geometries, and two porous media, including sand and compact metallic powder, were numerically solved. To discretize the governing equations, a finite control volume method was applied. As most of the proposed correlations for the thermophysical properties of the NF were inaccurate, especially for thermal conductivity, a new predictive correlation was proposed using the multi-variable regression method with acceptable accuracy. It was found that the cooling performance improved with any increase in the NP loading. A higher nanoparticle concentration yielded better cooling characteristics, which was 11.93% for 4% volume. The sand porous medium also yielded a much higher value of the normalized Nusselt number (Nu) compared to the other medium. The entropy generation (EG) enhancement was maximum for the triangular hot block in a sand porous cavity.

Keywords: CFVM; mixed convection; electronic cooling; correlation; thermal conductivity (search for similar items in EconPapers)
JEL-codes: O13 Q Q0 Q2 Q3 Q5 Q56 (search for similar items in EconPapers)
Date: 2021
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