Timber Chips as the Insulation Material for Energy Saving in Prefabricated Offices

Yupeng Wang and Hiroatsu Fukuda
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Yupeng Wang: School of Architecture and Civil Engineering, Chengdu University, Chengdu 610106, China
Hiroatsu Fukuda: Department of Architecture, The University of Kitakyushu, Kitakyushu 808-0135, Japan

Sustainability, 2016, vol. 8, issue 6, 1-12

Abstract: This research demonstrates the feasibility of a roof insulation method for prefabricated offices that uses vinyl packed timber chips to reduce air conditioning loads (hereinafter referred to as AC loads) and which also improves indoor thermal comfort. The advantages of the new roof insulation method were revealed through comparing the impacts of four roof types on prefabricated offices. The AC load and indoor thermal comfort (surface temperature and air temperature) were evaluated. The disposal of scrap timber discarded from building construction projects is costing money, and is also a waste of natural resources. The assessment of a new roof insulation method with timber chips demonstrates the advanced usage of timber chips, reducing the environmental load in the building construction process. On the other hand, since prefabricated offices have lower thermal storage capacities and are less airtight than RC (reinforced concrete) or S (steel) structured buildings, the AC load consumption and indoor thermal comfort exacerbation in prefabricated offices is more serious. Especially in summer, a large amount of solar energy absorption from the roof raises the indoor air temperature and significantly increases the cooling load. This research contributes to the environmental design for prefabricated offices, and develops a method for the reuse of wood chips.

Keywords: environmental modeling; prefabricated office; AC load; thermal comfort; roof insulation (search for similar items in EconPapers)
JEL-codes: O13 Q Q0 Q2 Q3 Q5 Q56 (search for similar items in EconPapers)
Date: 2016
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (1)

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