The Quality Test of Wire Bonding

Caiyuan Wang and Ronglu Sun

Modern Applied Science, 2009, vol. 3, issue 12, 50

Abstract: The reliability of the IC chip during performance of its function in any application is very much dependant on the quality of the wire bond interconnection. If the quality of the wire bond interconnection is poor and not consistent, it has a significant impact on the reliability and dependability of the device. The quality of a wire bond is determined by the strength of the interfaces between the bond wire and the bond pad as well as the bond wire and the lead finger. In this article, we discuss in detail established methodologies such as bond pull test, bond shear test, visual inspection and some special test of quality.

Date: 2009
References: View complete reference list from CitEc
Citations:

Downloads: (external link)
https://ccsenet.org/journal/index.php/mas/article/download/4589/3928 (application/pdf)
https://ccsenet.org/journal/index.php/mas/article/view/4589 (text/html)

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:ibn:masjnl:v:3:y:2009:i:12:p:50

Access Statistics for this article

More articles in Modern Applied Science from Canadian Center of Science and Education Contact information at EDIRC.
Bibliographic data for series maintained by Canadian Center of Science and Education ().