 Effect of aspect ratio on the ladder type triangle micro channels employed micro cooling systemsR. Brinda, R. Joseph Daniel and K. Sumangala International Journal of Enterprise Network Management, 2016, vol. 7, issue 2, 172-189 Abstract: Effective heat transfer in micro cooling systems for VLSI circuits requires large substrate area that is in contact with the flowing liquid and availability of large mass of fluid to carry away the heat. Such heat sinks formed with a collection of parallel ladder type micro channels with triangular cross section extends wall area, provides moderate heat transfer coefficient thus achieving lesser thermal resistances at less pumping power as reported earlier. In this work, the authors have studied the performance of four groups of such devices having five height-to-width ratios using COMSOL multiphysics. The performance-indicating parameters of such heat sinks show that high performance heat sinking can be achieved when the height-to-width ratio is high. It is indeed an interesting finding because this gives larger freedom in the design and it is possible to design the micro coolers with least pumping power and thermal resistance. Keywords: thermal performance; micro channel heat sinks; ladder type micro channels; hydraulic performance; IC cooling system; aspect ratio; microcooling systems; heat transfer; VLSI circuits; thermal resistance; pumping power; height-to-width ratio; microcooler design. (search for similar items in EconPapers) Downloads: (external link) Related works: Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text Persistent link: https://EconPapers.repec.org/RePEc:ids:ijenma:v:7:y:2016:i:2:p:172-189 Access Statistics for this article More articles in International Journal of Enterprise Network Management from Inderscience Enterprises Ltd |
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